Title :
High-Resolution Piezo Inkjet Printhead Fabricated by Three Dimensional Electrical Connection Method using through Glass VIA
Author :
Murata, M. ; Kondoh, T. ; Yagi, T. ; Funatsu, N. ; Tanaka, K. ; Tsukuni, H. ; Ohno, K. ; Usami, H. ; Nayve, R. ; Inoue, N. ; Seto, S. ; Morita, N.
Author_Institution :
Fuji Xerox Co., Ltd.
Abstract :
High-resolution piezo inkjet (PIJ) printhead with 1200 nozzles per inch (npi) has been developed. A glass substrate with through holes is bonded to Si substrate with piezo actuators (PAs) placed in matrix array (32times16) via polyimide film planarized by grinding method. A thin PA composed of sputter-deposited Pb(Zr,Ti)O3 (PZT) film and Si diaphragm contributes to a shrink of PA size and then high dense integration. The through holes are electroplated with Ni, and Ti/Cu interconnect is formed by resist spray coating and wet etching method. The glass substrate also acts as an encapsulation plate to form a cavity space over the PA, which enables a desirable displacement of the PA. The PIJ printhead exhibited a successful ejection of 2pl ink drops by single jetting drive and 8pl ink drops by three multiple jetting drive.
Keywords :
copper; electric connectors; ink jet printers; integrated circuit interconnections; lead compounds; nickel; polymer films; silicon; sputter deposition; titanium; zirconium compounds; 3D electrical connection method; Ni; PZT; PZT film; Si; Ti-Cu; VIA; grinding method; high-resolution piezo inkjet printhead fabrication; piezoactuators; polyimide film; resist spray coating; through glass; wet etching method; Actuators; Bonding; Drives; Glass; Ink; Polyimides; Resists; Semiconductor films; Spraying; Substrates;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805430
