Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics Packaging

Author

Toschi, Francesco ; Tamburri, Emanuela ; Guglielmotti, Valeria ; Terranova, Maria Letizia ; Reale, Andrea ; Carlo, Aldo Di ; Passeri, Daniele ; Rossi, Marco ; Falessi, Carlo ; Fiorello, Annamaria ; Buttiglione, Roberta

Author_Institution

Univ. of Rome Tor Vergata, Rome

fYear

2008

fDate

10-15 Feb. 2008

Firstpage

55

Lastpage

59

Abstract

The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelectronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers.

Keywords

carbon nanotubes; nanocomposites; polymers; thermal conductivity; thermal management (packaging); thermal resistance; C; carbon nanotubes-based composites; electronics packaging; epoxy resins; heat dissipation; microelectronic devices; nanocomposite layers; single wall carbon nanotubes; thermal characterization; thermal conductivity; thermal resistance; Carbon nanotubes; Dispersion; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Epoxy resins; Nanoscale devices; Resistance heating; Thermal conductivity; Thermal resistance; Carbon Nanotubes; Epoxy Resin; Nanocomposite; TIM; Thermal Interface Materials; Thermal Management;

fLanguage

English

Publisher

ieee

Conference_Titel

Quantum, Nano and Micro Technologies, 2008 Second International Conference on

Conference_Location

Sainte Luce

Print_ISBN

978-0-7695-3085-7

Type

conf

DOI

10.1109/ICQNM.2008.20

Filename

4455932