Title :
Novel Technology for Capacitive Pressure Sensors with Monocrystalline Silicon Membranes
Author :
Knese, K. ; Armbruster, S. ; Weber, H. ; Fischer, M. ; Benzel, H. ; Metz, M. ; Seidel, H.
Author_Institution :
Eng.-Sensor Technol. Center, Robert Bosch GmbH, Reutlingen
Abstract :
We report on a novel surface micromachining technology for the fabrication of capacitive absolute pressure sensors. The pressure sensitive membrane is formed by single crystal silicon enabling excellent long term stability. The membrane formation is based on the Advanced Porous Silicon Membrane (APSM) process [1], which is currently applied to piezoresistive transducers. Expanding this technology to capacitive transduction allows for a greater flexibility in tailoring the sensor properties to specific applications [2]. This expansion is implemented by adding a poly-Si counter electrode layer on top of the membrane in a surface micromachining step. Since only front side processing on standard silicon substrates is used, this method is very cost-efficient and fully CMOS-compatible, enabling monolithic integration of circuitry.
Keywords :
CMOS integrated circuits; capacitive sensors; electrochemical electrodes; elemental semiconductors; micromachining; microsensors; piezoresistive devices; porous semiconductors; pressure sensors; silicon; APSM process; CMOS; Si; advanced porous silicon membrane; capacitive pressure sensor fabrication; capacitive transduction; monocrystalline silicon membrane; monolithic integration; piezoresistive transducer; polysilicon counter electrode layer; standard silicon substrate; surface micromachining technology; Biomembranes; Capacitive sensors; Counting circuits; Electrodes; Fabrication; Micromachining; Piezoresistance; Silicon; Stability; Transducers;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805478