DocumentCode :
3045441
Title :
Silicon Carbide Surface Micromachining Technology by Tetramethylsilane-Based Atmospheric Vapor Deposition
Author :
Hatakeyama, Y. ; Esashi, M. ; Tanaka, S.
Author_Institution :
Grad. Sch. of Eng., Tohoku Univ., Tohoku
fYear :
2009
fDate :
25-29 Jan. 2009
Firstpage :
709
Lastpage :
712
Abstract :
Systematic study on selective silicon carbide (SiC) deposition on SiN, SiO2 and Si was performed. Poly-SiC was deposited by atmospheric pressure vapor deposition (APCVD) using tetramethylsilane (TMS), which allows easy handling and low temperature deposition. We found a process condition enabling the selective SiC deposition as well as a design guideline for SiC surface micromachining based on the selective SiC deposition. If both process condition and design guideline are used, continuous fine-grained SiC films are deposited on SiN and Si, while SiC islands are deposited on SiO2. SiC films on SiN are used as the microstructures, and SiC islands on SiO2 are lifted off by SiO2 sacrificial etching. Finally, movable SiC microstructures were fabricated by the developed surface micromachining technology.
Keywords :
micromachining; silicon compounds; vapour deposition; SiC; SiN; SiO2; atmospheric pressure vapor deposition; atmospheric vapor deposition; surface micromachining technology; Chemical vapor deposition; Etching; Guidelines; Micromachining; Microstructure; Process design; Semiconductor films; Silicon carbide; Silicon compounds; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
ISSN :
1084-6999
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2009.4805481
Filename :
4805481
Link To Document :
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