• DocumentCode
    3046123
  • Title

    Model of on-chip VGP-CPW with P+ implant in CMOS process

  • Author

    Wen, Jincai ; Lou, Jia ; Sun, Lingling

  • Author_Institution
    Key Lab. for RF Circuits & Syst. of Minist. of Educ., Hangzhou Dianzi Univ., Hangzhou, China
  • fYear
    2011
  • fDate
    12-14 Dec. 2011
  • Firstpage
    428
  • Lastpage
    431
  • Abstract
    This paper presents a vertical-ground-plane coplanar waveguide (VGP-CPW) line with P+ implant, and compared the characteristic parameters of transmission line with the general VGP-CPW structures. The ground plane connected to the substrate makes the proposed CPW line have higher isolation and lower characteristic impedance. The physical model of the VGP-CPW with P+ implant is presented as well as the general VGP-CPW line. Two different structures of transmission lines are fabricated in 65 nm 1P8M RF CMOS process and models are verified by the measured S-parameters up to 50 GHz.
  • Keywords
    CMOS integrated circuits; coplanar transmission lines; coplanar waveguides; field effect MIMIC; 1P8M RF CMOS process; P+ implant; S-parameters; frequency 50 GHz; on-chip VGP-CPW model; size 65 nm; transmission line; vertical-ground-plane coplanar waveguide line; Coplanar waveguides; Implants; Integrated circuit modeling; Semiconductor device modeling; Solid modeling; Substrates; Transmission line measurements; CMOS; P+ implant; VGP-CPW; model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits (ISIC), 2011 13th International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-61284-863-1
  • Type

    conf

  • DOI
    10.1109/ISICir.2011.6131988
  • Filename
    6131988