Title :
A multi-dimensional residual functional for obtaining the Proper Orthogonal Decomposition coefficients in model reduction
Author :
Rios, Richard ; Espinosa, Jairo J. ; Mejia, Carlos E.
Author_Institution :
Grupo de Autom. de la UNAL, Univ. Nac. de Colombia Sede Medellin, Sede Medellin, Colombia
Abstract :
This paper presents a multi-dimensional residual functional for deriving the POD (Proper Orthogonal Decomposition) coefficients of systems described with partial differential equations of one variable in a bidimensional spatial domain, when a POD approach is used for deriving a reduced order model. Model reduction with a POD approach is a technique that uses the signal spectral decomposition and the Galerkin projection for deriving reduced order models. Recently there has been a growing interest in the POD community in the subject of tensor decomposition, since it can address some of the outcomes observed in the current based matrix technique. The main purpose of using tensor decomposition is to derive multidimensional basis functions, which are essential for obtaining a spectral decomposition of the system solution. However, multidimensional basis functions do not match with the residual functional developed in the traditional matrix technique, therefore a generalization of this residual function is needed in order to obtain the POD coefficients.
Keywords :
Galerkin method; partial differential equations; reduced order systems; signal processing; Galerkin projection; POD; bidimensional spatial domain; model reduction; multidimensional basis function; multidimensional residual functional; partial differential equation; proper orthogonal decomposition coefficient; reduced order model; signal spectral decomposition; tensor decomposition; Approximation methods; Data models; Heating; Mathematical model; Matrix decomposition; Reduced order systems; Tensile stress; Multi-linear algebra; Proper Orthogonal Decomposition (POD); Singular Value Decomposition (SVD); reduced order systems; tensor decomposition;
Conference_Titel :
ANDESCON, 2010 IEEE
Conference_Location :
Bogota
Print_ISBN :
978-1-4244-6740-2
DOI :
10.1109/ANDESCON.2010.5633415