DocumentCode
3046392
Title
Thermoelastic FEM-BEM Model for MEMS Resonator Simulation
Author
Ekeom, D. ; Buchaillot, L.
Author_Institution
Microsonics, St. Avertin
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
923
Lastpage
926
Abstract
Minimization of dissipative losses is a major goal in MEMS resonator design [1]-[2]. For an accurate simulation of a MEMS resonator vibrating in vacuum, thermoelastic damping phenomenon related to the irreversible heat dissipation induced by the coupling between heat transfer and strain rate during the resonator vibration and acoustic radiation into the substrate have to be taken into account. The finite element method (FEM) is suitable for structural simulation, especially for thermoelastic damped structures vibrating in vacuum. When the vibrating structure is deposited on an unbounded elastic medium, radiating conditions have to be taken into account. The boundary element method (BEM) is suitable for unbounded medium, because the radiating conditions are exact. It is often used to complete of the finite element method. The goal of our work is to develop and to validate a thermal-electromechanical FEM-BEM tool, which is helpful to predict and understand MEMS energy loss dissipation.
Keywords
boundary-elements methods; circuit simulation; finite element analysis; heat transfer; matrix algebra; micromechanical resonators; MEMS energy loss dissipation; MEMS resonator simulation; acoustic radiation; boundary element method; finite element method; heat transfer; irreversible heat dissipation; resonator vibration; strain rate; thermoelastic FEM-BEM model; thermoelastic damped structures; Acoustic beams; Damping; Electrodes; Energy loss; Finite element methods; Heat transfer; Micromechanical devices; Q factor; Resonant frequency; Thermoelasticity;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805535
Filename
4805535
Link To Document