Title :
Stress and coplanarity analysis of 225 BGA package
Author :
Chidambaram, N. ; Papageorge, Marc
Author_Institution :
ASAT Inc., Palo Alto, CA, USA
Abstract :
Stress and warpage analysis results of a 225 plastic Ball Grid Array (BGA) package with different design options are presented in this paper. The effect of package design parameters such as mold compound type, substrate thickness and mold corner radius are modeled and compared to measurements. Maximum stress occurs at the corner of the die and coplanarity strongly depends on mold compound and board thickness
Keywords :
deformation; integrated circuit packaging; plastic packaging; stress analysis; surface mount technology; 225 BGA package; coplanarity analysis; mold compound type; mold corner radius; package design parameters; plastic ball grid array; stress analysis; substrate thickness; warpage analysis; Assembly; Copper; Electronics packaging; Geometry; Microassembly; Packaging machines; Plastic packaging; Silicon; Thermal stresses; Thickness measurement;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404732
