DocumentCode
3046432
Title
Analytical Modeling and Numerical Simulation of Capacitive Silicon Bulk Acoustic Resonators
Author
Casinovi, C. ; Gao, X. ; Ayazi, F.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
935
Lastpage
938
Abstract
This paper introduces two newly developed models of capacitive silicon bulk acoustic resonators (SiBARs). The first model is analytical and is obtained from an approximate solution of the linear elastodynamics equations for the SiBAR geometry. The second is numerical and is based on finite-element, multi-physics simulation of both acoustic wave propagation in the resonator and electromechanical transduction in the capacitive gaps of the device. This latter model makes it possible to compute SiBAR performance parameters that cannot be obtained from the analytical model, e.g. the relationship between transduction area and insertion loss. Comparisons with measurements taken on a set of silicon resonators fabricated using electron-beam lithography show that both models can predict the resonant frequencies of SiBARs with a relative error smaller than 1%.
Keywords
acoustic resonators; electron beam lithography; elemental semiconductors; finite element analysis; silicon; Si; SiBAR geometry; acoustic wave propagation; analytical modeling; capacitive silicon bulk acoustic resonators; elastodynamics equation; electromechanical transduction; electron-beam lithography; finite-element analysis; insertion loss; multiphysic simulation; numerical simulation; Analytical models; Computational modeling; Elastodynamics; Equations; Finite element methods; Geometry; Numerical models; Numerical simulation; Silicon; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805538
Filename
4805538
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