Title :
Laser ablation: A supporting technique to micromachining of SiC
Author :
Vanko, G. ; Zehetner, J. ; Choleva, P. ; Lalinsky, T. ; Hudek, P.
Author_Institution :
Inst. of Electr. Eng., Bratislava, Slovakia
Abstract :
We present an effective fabrication method of AlGaN/GaN membrane on SiC for MEMS sensors applications. It employs laser ablation as a supporting technique to the plasma enhanced etching methods. Circular patterns transferred deeply into bulk SiC substrates fabricated by ablation using (1) excimer laser and (2) femtosecond (fs) laser tools were compared. We found that the fs laser tool is more suitable for bulk micromachining of SiC because of the clearness of the process. The additional higher thermal load can be also suppressed. A simple laser cleaning procedure was found allowing us to fabricate deep structures without the ablation process retardation by debris formation.
Keywords :
III-V semiconductors; aluminium compounds; excimer lasers; gallium compounds; high-speed optical techniques; laser ablation; membranes; micromachining; microsensors; semiconductor heterojunctions; sputter etching; wide band gap semiconductors; AlGaN-GaN; MEMS sensor applications; SiC; additional high thermal loading; bulk micromachining; circular patterns; debris formation; deep structures; excimer laser tools; femtosecond laser tools; fs laser tool; laser ablation; membrane; micromachining; plasma enhanced etching methods; simple laser cleaning procedure; supporting technique; Gallium nitride; Laser ablation; Laser beams; Laser theory; Semiconductor lasers; Silicon carbide; Substrates;
Conference_Titel :
Advanced Semiconductor Devices & Microsystems (ASDAM), 2012 Ninth International Conference on
Conference_Location :
Smolenice
Print_ISBN :
978-1-4673-1197-7
DOI :
10.1109/ASDAM.2012.6418518