• DocumentCode
    3047298
  • Title

    Lever-Based CMOS-MEMS Probes for Reconfigurable RF IC´s

  • Author

    Liu, J. ; Noman, M. ; Bain, J.A. ; Schlesinger, T.E. ; Fedder, G.K.

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    1111
  • Lastpage
    1114
  • Abstract
    We report on new lever-based CMOS-MEMS electrothermal probes for memory-intensive self-configuring integrated circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure ICs, mainly RF ICs such as inductors, by mechanically addressing and passing current through resistance change (RC) vias embedded within the chip circuitry. The lever-based actuation causes the probe tips to move away from the probe substrate and toward the RC via substrate, which is in contrast to the previous design where actuation caused the tips to move away from the RC via substrate. Two independently actuated probes are located 3 mum apart to provide two simultaneous contacts that form a reconfiguration current return path. Thermal management such as dummy heater beams and thermal isolation structures are employed to improve the temperature uniformity and drive efficiency. A statistic semi-sphere model is employed to model the contact.
  • Keywords
    CMOS integrated circuits; micromechanical devices; radiofrequency integrated circuits; chip circuitry; dummy heater beams; lever-based CMOS-MEMS probes; memory-intensive self-configuring integrated circuits; reconfigurable RF IC; resistance change; statistic semi-sphere model; thermal isolation structures; thermal management; CMOS integrated circuits; Electrothermal effects; Inductors; Micromechanical devices; Probes; Radio frequency; Radiofrequency integrated circuits; Statistics; Temperature; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805582
  • Filename
    4805582