DocumentCode :
3048048
Title :
Anisotropic resist reflow process simulation for 32 nm node elongated contact holes
Author :
Park, Joon-Min ; Kim, Dai-Gyoung ; Hong, Joo-Yoo ; Oh, Hye-Keun
Author_Institution :
Hanyang Univ., Ansan
fYear :
2007
fDate :
5-8 Nov. 2007
Firstpage :
90
Lastpage :
91
Abstract :
In general, it is very hard to correctly predict the elongated contact hole resist reflow process ( CH RRP) due to position shift and pattern size irregularity of RRP, because simple RRP simulator uses isotropic resist flow. Therefore RRP simulator was upgraded which can correctly predict the elongated CH RRP by adding the bulk effect and anisotropic reflow. Optical proximity correction for 32 nm node was also applied to the elongated CH RRP to correctly predict the anisotropic elongated CH. The experimental and simulated CH patterns after RRP were compared and found that the simulator can correctly predict the behavior of complex CH array after RRP.
Keywords :
nanopatterning; photoresists; proximity effect (lithography); semiconductor process modelling; CH RRP; anisotropic resist reflow process simulation; contact hole pattern size; elongated contact hole resist reflow process; optical proximity correction; size 32 nm; Anisotropic magnetoresistance; Geometrical optics; Moon; Optical arrays; Physics; Predictive models; Resists; Temperature; 32 nm pattern; elongated contact hole; optical proximity correction; resist reflow process;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
Type :
conf
DOI :
10.1109/IMNC.2007.4456119
Filename :
4456119
Link To Document :
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