Title :
Fabrication of nanostencil using size reduction of micro-aperture by additional deposition
Author :
Lee, J.S. ; Park, W.B. ; Park, C.W. ; Kim, G.M.
Author_Institution :
Kyungpook Nat. Univ., Daegu
Abstract :
A low-cost method for nanostencil fabrication is demonstrated. The micro-stencils were fabricated by means of standard MEMS processes of conventional photolithography and bulk etching of Si substrate. The size of the micro-apertures was reduced down to sub-micron-meter scale by the additional deposition of SiO2 on SiN stencil membrane. In this study, 500- mum-thick SiO2 were deposited by PECVD from upside and downside of the stencil in order to study the size reduction of the apertures. Because the micro-aperture has a taper in the membrane of the micro-stencil due to SiN membrane etching, the deposition rate showed different with deposition direction.
Keywords :
etching; micromechanical devices; nanopatterning; photolithography; plasma CVD; silicon compounds; MEMS processes; PECVD; Si; SiO2-SiN; membrane etching; microaperture; microstencil membrane; nanopatterning; nanostencil fabrication; photolithography; size 500 mum; Apertures; Biomembranes; Costs; Etching; Internal stresses; Lithography; Micromechanical devices; Nanopatterning; Optical device fabrication; Silicon compounds;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456168
