• DocumentCode
    3048952
  • Title

    Structural and sensing characteristics of Pr2O3 sensing membrane for pH-ISFET

  • Author

    Pan, Tung-Ming ; Liao, Kao-Ming ; Cheng, Chih-Hung ; Lin, Jian-Chyi

  • Author_Institution
    Chang Gung Univ., Kwei-Shan
  • fYear
    2007
  • fDate
    5-8 Nov. 2007
  • Firstpage
    198
  • Lastpage
    199
  • Abstract
    In this paper, the physical and sensing properties of physical vapor deposition Pr2O3 dielectrics deposited on Si substrate were explored. A 30 nm Pr2O3 dielectric was grown on the p-type Si (100) wafer by reactive RF sputtering from a praseodymium target with a argon-to-oxygen (Ar/O2) flow ratio of 10/4. Post deposition annealing of the samples was carried out using a conventional rapid thermal annealing (RTA) system in O2 ambient for 30-s at different temperatures. A 300-nm Al was deposited on the backside of Si wafer by thermal evaporator. The sensing area was defined by a photosensitive epoxy. The pH sensitivities of Pr2O3 sensing films were all extracted by capacitance-voltage (C-V) curves of EIS structures. C-V curves for various pH buffer solutions of Merck Inc. were measured through Ag/AgCl reference electrode by Hewlet-Packard 4284A.
  • Keywords
    X-ray diffraction; chemical sensors; dielectric thin films; ion sensitive field effect transistors; pH measurement; praseodymium compounds; rapid thermal annealing; silicon; sputter deposition; surface roughness; Pr2O3; Si; XRD spectra; dielectric film; pH- ion sensitive field effect transistors; postdeposition annealing; rapid thermal annealing; reactive RF sputtering; sensing membrane; size 30 nm; surface roughness; temperature 800 C to 900 C; thermal evaporator; Annealing; Biomembranes; Capacitance-voltage characteristics; Dielectric substrates; High K dielectric materials; High-K gate dielectrics; Hysteresis; Silicon; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology, 2007 Digest of papers
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9902472-4-9
  • Type

    conf

  • DOI
    10.1109/IMNC.2007.4456172
  • Filename
    4456172