Title :
Improving the circuit pack manufacturing yield by the methods of analyzing the circuit pack repair data
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
Abstract :
A large share of electronic system manufacturing cost is related to the process of assembly, diagnosis, and circuit board repair. To enhance the circuit pack diagnosis accuracy and efficiency, and the yield of product, two analysis methods based on the repair data collected by a computer-integrated manufacturing system have been devised. One is test program evaluation, and the other is detailed circuit pack failure mode analysis. The main purpose is to reduce the total cost of product and enhance the quality. Currently, tools for analyzing test programs and detailed FMA for circuit codes have been installed in four AT&T manufacturing locations and interfaced with other AT&T internal software systems
Keywords :
CAD/CAM; failure analysis; printed circuit manufacture; AT&T; accuracy; circuit pack manufacturing yield; computer-integrated manufacturing system; diagnosis; efficiency; electronic system manufacturing cost; failure mode analysis; repair data; test program evaluation; Assembly systems; Circuit testing; Computer integrated manufacturing; Costs; Failure analysis; Manufacturing processes; Printed circuits; Software systems; Software testing; System testing;
Conference_Titel :
Engineering Management Conference, 1990. Management Through the Year 2000 - Gaining the Competitive Advantage, 1990 IEEE International
Conference_Location :
Santa Clara, CA
DOI :
10.1109/IEMC.1990.201258
