• DocumentCode
    3049594
  • Title

    A finite element mesh tailored to full NIL process modelling: hot embossing, cool-down and stamp release

  • Author

    Mendels, D.-A. ; Fernandez-Cuesta, I. ; Borrisé, X. ; Retolaza, A. ; Merino, S. ; Hansen, O. ; Kristensen, A. ; Peréz-Murano, F.

  • Author_Institution
    Nat. Phys. Lab., Teddinton
  • fYear
    2007
  • fDate
    5-8 Nov. 2007
  • Firstpage
    278
  • Lastpage
    279
  • Abstract
    This paper details the building of a finite element mesh tailored to the simulation of a complete nano-imprint lithography process. A novel approach to meshing of FE structures is devised, to address the issues specific to the NIL process: large aspect ratio and slip distance. It consists in generating a finely meshed structure as it should be after embossing and prior to releasing, and applying a geometric transformation to this structure so that it is "squeezed" back into the original flat geometry of the resist. Mesh created is not distorted or degenerate. The gain in terms of computing performance is roughly one order of magnitude, as the convergence speed is increased.
  • Keywords
    convergence of numerical methods; embossing; mesh generation; nanolithography; resists; soft lithography; NIL process modelling; aspect ratio; convergence speed; cool-down; finite element mesh; geometric transformation; hot embossing; nanoimprint lithography; slip distance; stamp release; Adhesives; Capacitive sensors; Elasticity; Embossing; Finite element methods; Polymers; Resists; Shape; Temperature; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology, 2007 Digest of papers
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9902472-4-9
  • Type

    conf

  • DOI
    10.1109/IMNC.2007.4456212
  • Filename
    4456212