DocumentCode :
3049594
Title :
A finite element mesh tailored to full NIL process modelling: hot embossing, cool-down and stamp release
Author :
Mendels, D.-A. ; Fernandez-Cuesta, I. ; Borrisé, X. ; Retolaza, A. ; Merino, S. ; Hansen, O. ; Kristensen, A. ; Peréz-Murano, F.
Author_Institution :
Nat. Phys. Lab., Teddinton
fYear :
2007
fDate :
5-8 Nov. 2007
Firstpage :
278
Lastpage :
279
Abstract :
This paper details the building of a finite element mesh tailored to the simulation of a complete nano-imprint lithography process. A novel approach to meshing of FE structures is devised, to address the issues specific to the NIL process: large aspect ratio and slip distance. It consists in generating a finely meshed structure as it should be after embossing and prior to releasing, and applying a geometric transformation to this structure so that it is "squeezed" back into the original flat geometry of the resist. Mesh created is not distorted or degenerate. The gain in terms of computing performance is roughly one order of magnitude, as the convergence speed is increased.
Keywords :
convergence of numerical methods; embossing; mesh generation; nanolithography; resists; soft lithography; NIL process modelling; aspect ratio; convergence speed; cool-down; finite element mesh; geometric transformation; hot embossing; nanoimprint lithography; slip distance; stamp release; Adhesives; Capacitive sensors; Elasticity; Embossing; Finite element methods; Polymers; Resists; Shape; Temperature; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
Type :
conf
DOI :
10.1109/IMNC.2007.4456212
Filename :
4456212
Link To Document :
بازگشت