DocumentCode
3049748
Title
Imprinting of polyimide without residual layers
Author
Pai, I-Ting ; Leu, Ing-Chi ; Hon, Min Hsiung
Author_Institution
Nat. Cheng Kung Univ., Tainan
fYear
2007
fDate
5-8 Nov. 2007
Firstpage
296
Lastpage
297
Abstract
In this study, imprinting condition of 180degC for 20 minutes is used to fabricate patterned polyimide (PI) films. Results provides a simple approach to fabricate patterns without residual layer due to the dewetting behavior between the poly-amic acid (PAA) solution and imprint stamp.
Keywords
moulding; polymer films; dewetting; polyamic acid solution; polyimide films; polyimide imprinting; temperature 180 degC; time 20 min; Cleaning; Copper; Curing; Materials science and technology; Polyimides; Scanning electron microscopy; Solvents; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location
Kyoto
Print_ISBN
978-4-9902472-4-9
Type
conf
DOI
10.1109/IMNC.2007.4456221
Filename
4456221
Link To Document