Title :
Dependence of Mold Conditions on Demolding Force - Effects of Water Contact Angle and Pattern Shape around Top Surface
Author :
Kayama, M. ; Ishihara, J. ; Kawata, H. ; Yasuda, M. ; Hirai, Y.
Author_Institution :
Osaka Prefecture Univ., Osaka
Abstract :
In this report the friction coefficient is controlled by varying the surface treatment conditions of the mold and the press stress is controlled by changing the pattern shape of the mold. The demolding force is measured for various mold conditions. The demolding force clearly increases as the water contact angle decreases. This result shows that the friction coefficient increases dependence as the water contact angle decreases.
Keywords :
contact angle; elemental semiconductors; etching; moulding; polymers; silicon; Si; demolding force; friction coefficient; mold patterns; surface treatment; water contact angle; wet etching; Chromium; Force measurement; Friction; Plasma temperature; Shape; Silicon; Sputter etching; Stress; Surface treatment; Wet etching;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456226
