• DocumentCode
    3050122
  • Title

    Electrical tracking in cycloaliphatic epoxy based nano structured composites

  • Author

    Guastavino, F. ; Thelakkadan, A.S. ; Coletti, G. ; Ratto, A.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Genova, Genova, Italy
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    701
  • Lastpage
    704
  • Abstract
    This investigation is dedicated to the development of a new class of nanostructured composite material from cycloaliphatic epoxy polymers with nanoclay and microsilica as the fillers and the analysis of the behavior associated in the inclined plane tracking test (IEC 60587). Composite materials with different weight percentages of fillers were prepared and subjected to electrical tracking according to the standard. XRD and SEM measurements were carried out to study the dispersion of the fillers and the morphology of the composites. It has been found that the nanostructured composite prepared with a lesser amount of nanoclay (1.0 to 2.5 wt%) showed a better resistance to tracking and erosion under wet contaminated conditions in the inclined plane tracking test.
  • Keywords
    X-ray diffraction; clay; electrical resistivity; epoxy insulation; filled polymers; insulation testing; nanocomposites; scanning electron microscopy; silicon compounds; surface discharges; X-ray diffraction; cycloaliphatic epoxy polymers; electrical tracking; erosion; inclined plane tracking test; microsilica; nanoclay; nanostructured composites; scanning electron microscopy; Composite materials; Dispersion; Electrical resistance measurement; IEC standards; Materials testing; Nanocomposites; Nanostructured materials; Pollution measurement; Polymers; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
  • Conference_Location
    Virginia Beach, VA
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-4557-8
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2009.5377719
  • Filename
    5377719