DocumentCode :
3050158
Title :
Electrical and thermal ageing of microcomposite nano-filled epoxy: Influence on space charge accumulation
Author :
Castellon, J. ; Nguyen, H.N. ; Agnel, S. ; Toureille, A. ; Fréchette, M.
Author_Institution :
Inst. d´´Electron. du Sud, Montpellier, France
fYear :
2009
fDate :
18-21 Oct. 2009
Firstpage :
715
Lastpage :
718
Abstract :
Nanotechnologies are now inevitable regardless of the scope. In electrical engineering, especially in the context of "major" power systems, insulating materials of tomorrow are in the field of nanotechnologies. These new materials are commonly called "nanodielectrics". Having conducted numerous studies on the intrinsic electrical properties of nanomaterials, we propose in this work to study the electrical and thermal ageing of nanostructured microcomposite epoxies. To do this, we used a non-destructive method of space charge measurements in solid insulating materials called the "thermal step method" to measure the evolution of charges trapped in the insulation during ageing. We will thus demonstrate the benefits or not in relation to the presence of nanoparticles in the insulating matrix.
Keywords :
ageing; dielectric materials; epoxy insulation; epoxy insulators; filled polymers; heat treatment; nanocomposites; nanoparticles; space charge; electrical ageing; electrical engineering; microcomposite nanofilled epoxy; nanodielectrics; nanoparticles; solid insulating materials; space charge accumulation; thermal ageing; thermal step method; Aging; Charge measurement; Conducting materials; Current measurement; Dielectrics and electrical insulation; Electrical engineering; Nanomaterials; Nanostructured materials; Power systems; Space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
Conference_Location :
Virginia Beach, VA
ISSN :
0084-9162
Print_ISBN :
978-1-4244-4557-8
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2009.5377721
Filename :
5377721
Link To Document :
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