DocumentCode
3050565
Title
An Examination of Shrink Processes and Double Patterning for Achieving 32 and 22 nm Technologies in Contact/Via Holes
Author
Nishimura, E. ; Kushibiki, M. ; Kawasaki, T. ; Shimura, S. ; Iwao, F. ; Carcasi, M. ; Scheer, S. ; Yaegashi, H.
Author_Institution
Tokyo Electron AT Ltd., Yamanashi
fYear
2007
fDate
5-8 Nov. 2007
Firstpage
396
Lastpage
397
Abstract
This paper investigates novel shrink processes and double patterning techniques as a means to enhancing resolution of water based optical immersion lithography. This paper also demonstrates single and double patterning solutions in conjunction with shrink processes for 32 and 22 nm technologies, respectively.
Keywords
immersion lithography; nanolithography; nanopatterning; contact holes; double patterning techniques; shrink processes; water based optical immersion lithography; Controllability; Dry etching; Electronics industry; Electrons; Fabrication; Lighting; Lithography; Numerical analysis; Resists; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location
Kyoto
Print_ISBN
978-4-9902472-4-9
Type
conf
DOI
10.1109/IMNC.2007.4456271
Filename
4456271
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