Title :
An Examination of Shrink Processes and Double Patterning for Achieving 32 and 22 nm Technologies in Contact/Via Holes
Author :
Nishimura, E. ; Kushibiki, M. ; Kawasaki, T. ; Shimura, S. ; Iwao, F. ; Carcasi, M. ; Scheer, S. ; Yaegashi, H.
Author_Institution :
Tokyo Electron AT Ltd., Yamanashi
Abstract :
This paper investigates novel shrink processes and double patterning techniques as a means to enhancing resolution of water based optical immersion lithography. This paper also demonstrates single and double patterning solutions in conjunction with shrink processes for 32 and 22 nm technologies, respectively.
Keywords :
immersion lithography; nanolithography; nanopatterning; contact holes; double patterning techniques; shrink processes; water based optical immersion lithography; Controllability; Dry etching; Electronics industry; Electrons; Fabrication; Lighting; Lithography; Numerical analysis; Resists; Space technology;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456271
