Dielectric characterization of high density polyethylene/SiO2 nanocomposites

Author

Sami, A. ; David, E. ; Fréchette, M.

Author_Institution

Ecole de Technol. Super. (ETS), Montreal, QC, Canada

fYear

2009

fDate

18-21 Oct. 2009

Firstpage

689

Lastpage

692

Abstract

High density polyethylene HDPE/SiO₂ nanocomposites were prepared by melt compounding using a twin screw extruder. The thermal properties of the composites were investigated by differential scanning calorimetry (DSC). The microstructures of nanocomposites were characterized by scanning and transmission electron microscopy (SEM and TEM). The dielectric breakdown strength of the nanocomposites was investigated using AC progressive-stress tests at a rate of voltage increase of 500 V/s. The nanoscale structure seems to affect the both the electrical and the thermal properties of the HDPE composites.

Keywords

differential scanning calorimetry; electric breakdown; filled polymers; nanocomposites; polyethylene insulation; scanning electron microscopy; silicon compounds; stress effects; transmission electron microscopy; AC progressive-stress tests; HDPE composite; SiO₂-Jk; dielectric breakdown strength; dielectric characterization; differential scanning calorimetry; high density polyethylene-silica nanocomposites; melt compounding; microstructures; nanoscale structure; scanning electron microscopy; thermal properties; transmission electron microscopy; twin screw extruder; Breakdown voltage; Calorimetry; Dielectric breakdown; Fasteners; Microstructure; Nanocomposites; Polyethylene; Scanning electron microscopy; Testing; Transmission electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on

Conference_Location

Virginia Beach, VA

ISSN

0084-9162

Print_ISBN

978-1-4244-4557-8

Electronic_ISBN

0084-9162

Type

conf

DOI

10.1109/CEIDP.2009.5377742

Filename

5377742