Title :
Dielectric characterization of high density polyethylene/SiO2 nanocomposites
Author :
Sami, A. ; David, E. ; Fréchette, M.
Author_Institution :
Ecole de Technol. Super. (ETS), Montreal, QC, Canada
Abstract :
High density polyethylene HDPE/SiO2 nanocomposites were prepared by melt compounding using a twin screw extruder. The thermal properties of the composites were investigated by differential scanning calorimetry (DSC). The microstructures of nanocomposites were characterized by scanning and transmission electron microscopy (SEM and TEM). The dielectric breakdown strength of the nanocomposites was investigated using AC progressive-stress tests at a rate of voltage increase of 500 V/s. The nanoscale structure seems to affect the both the electrical and the thermal properties of the HDPE composites.
Keywords :
differential scanning calorimetry; electric breakdown; filled polymers; nanocomposites; polyethylene insulation; scanning electron microscopy; silicon compounds; stress effects; transmission electron microscopy; AC progressive-stress tests; HDPE composite; SiO2-Jk; dielectric breakdown strength; dielectric characterization; differential scanning calorimetry; high density polyethylene-silica nanocomposites; melt compounding; microstructures; nanoscale structure; scanning electron microscopy; thermal properties; transmission electron microscopy; twin screw extruder; Breakdown voltage; Calorimetry; Dielectric breakdown; Fasteners; Microstructure; Nanocomposites; Polyethylene; Scanning electron microscopy; Testing; Transmission electron microscopy;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
Conference_Location :
Virginia Beach, VA
Print_ISBN :
978-1-4244-4557-8
Electronic_ISBN :
0084-9162
DOI :
10.1109/CEIDP.2009.5377742
