Title :
A Novel Contact Imprinting Lithography for Nano-Patterning and Nano-Fabrication
Author :
Lee, Y.-C. ; Chili, C.-Y.
Author_Institution :
Nat. Cheng Kung Univ., Tainan
Abstract :
This paper reports a simple but useful contact printing method for micro-and nano-patterning and fabrication. In this method, a silicon mold with some micro/nano-features is first coated with an anti-adhesion layer and then a metal layer, while the substrate is spin-coated with a thin polymer layer. Upon compressing the mold against the mold, the convex features of the mold will emboss into the polymer layer, and the patterned metal film is transferred into the polymer layer. The transferred metal pattern then serves as an etching mask for subsequent O2 plasma etching of polymer layer to complete the patterning process. This contact-transferred and mask-embedded lithography (CMEL) process offers many advantages.
Keywords :
elemental semiconductors; embossing; etching; masks; metallic thin films; nanolithography; nanopatterning; polymer films; silicon; soft lithography; spin coating; CMEL; O2 plasma etching; Si; antiadhesion layer; contact imprinting lithography; contact-transferred lithography; embossing; etching mask; mask-embedded lithography; micropatterning; mold compression; nanofabrication; nanopatterning; patterned metal film; silicon mold; spin coating; thin polymer layer; Chromium; Etching; Fabrication; Gratings; Lithography; Plasma applications; Polymer films; Semiconductor films; Silicon; Substrates;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456295