Examination of FIB Repair Resolution for UV-Nanoimprint Mold

Author

Okada, M. ; Nakamatsu, K. ; Kometani, R. ; Kanda, K. ; Haruyama, Y. ; Kaito, K. ; Matsui, S.

Author_Institution

Hyogo Univ., Ako

fYear

2007

fDate

5-8 Nov. 2007

Firstpage

454

Lastpage

455

Abstract

In this paper, the mold repair resolution for UV nanoimprint lithography (UV-NIL) by focused-ion-beam (FIB) etching and deposition is presented. A narrow line was fabricated on quartz mold by 30 kV Ga⁺ FIB etching at 0.4 pA. UV-NIL was carried out using the fabricated mold onto Si substrate coated with UV-NIL resin PAK-01 (Toyo Gosei Co.). The narrow line was imprinted on the PAK-01 coated Si substrate by UV-NIL. The line pattern with 28 nm width was successfully imprinted. The protrusion-defect on the quartz mold was repaired by 30 kV Ga⁺ FIB etching and the hollow-defect by FIB deposition using tetraethoxysilane [Si (OC₂H₅)₄] as a source gas. Results demonstrate that these defective molds can be repaired by FIB etching and deposition.

Keywords

focused ion beam technology; ion beam assisted deposition; nanolithography; quartz; soft lithography; sputter etching; ultraviolet lithography; FIB repair resolution; Ga⁺ FIB etching; Si; SiO₂; UV-NIL; UV-nanoimprint mold; focused-ion-beam deposition; nanoimprint lithography; narrow line imprint; protrusion-defect; quartz mold; silicon substrate; tetraethoxysilane; voltage 30 kV; Cooling; Costs; Gold; Nanolithography; Nanostructures; Nanotechnology; Scanning electron microscopy; Sputter etching; Temperature; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology, 2007 Digest of papers

Conference_Location

Kyoto

Print_ISBN

978-4-9902472-4-9

Type

conf

DOI

10.1109/IMNC.2007.4456300

Filename

4456300