• DocumentCode
    305111
  • Title

    Space charge measurements by the thermal step method in filled epoxyde systems

  • Author

    Castellon, J. ; Toureille, A.

  • Author_Institution
    Lab. d´´Electrotech. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
  • Volume
    1
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    141
  • Abstract
    We study the appearance and evolution of space charge in epoxyde systems filled with alumina, silica or Wollastonite. The thermal step characterization allows us to compare different insulating structures, in order to optimize reliability and life time. We investigate the space charge distributions in 3 samples tested before and after the application of electrical and thermal stresses. The results show fundamental differences between different materials and give information about the presence of space charges from the manufacturing process of these materials. We can therefore classify the tested materials. We also try to reveal the part played by space charge in the phenomenon of aging
  • Keywords
    ageing; charge measurement; composite insulating materials; epoxy insulation; filled polymers; insulation testing; life testing; reliability; space charge; thermal stresses; Al2O3 filled epoxyde; SiO2 filled epoxyde; Wollastonite filled epoxyde; aging; electrical stresses; filled epoxyde systems; insulating structures; life time; manufacturing process; reliability; space charge distributions; space charge measurements; thermal step method; thermal stresses; Charge measurement; Current measurement; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Electrodes; Space charge; Temperature distribution; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on
  • Conference_Location
    Millbrae, CA
  • Print_ISBN
    0-7803-3580-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1996.564618
  • Filename
    564618