Synthesis and dielectric properties of epoxy based nanocomposites

Author

Andritsch, T. ; Kochetov, R. ; Gebrekiros, Y.T. ; Lafont, U. ; Morshuis, P.H.F. ; Smit, J.J.

Author_Institution

Delft Univ. of Technol., Delft, Netherlands

fYear

2009

fDate

18-21 Oct. 2009

Firstpage

523

Lastpage

526

Abstract

Insulation based on epoxy resin is widely used in high voltage applications. This paper shows the formulation of epoxy based nanocomposites and the influence of the filler material on the DC breakdown strength. Filler materials discussed are SiO₂, Al₂O₃ and AlN with average particle size between 22 and 100 nm. AlN has been chosen because it has shown to considerably increase the thermal conductivity of epoxy resin. SiO₂ and Al₂O₃ are widely used as filler for electrical applications since they improve mechanical, thermal and electrical properties, beside neat epoxy samples, which have been used as reference. Base material for all samples is conventional bisphenol-A type epoxy resin with anhydrite hardener. Particle size and dispersion within the epoxy matrix have been validated via transmission electron microscopy. Breakdown measurements have been performed by means of DC ramp tests. Results of nano-Al₂O₃ samples have also been compared with surface functionalized microscale filler.

Keywords

III-V semiconductors; alumina; aluminium compounds; disperse systems; electric breakdown; electric strength; filled polymers; insulation; nanocomposites; particle size; silicon compounds; thermal conductivity; transmission electron microscopy; wide band gap semiconductors; Al₂O₃; AlN; DC breakdown strength; DC ramp tests; SiO₂; anhydrite hardener; bisphenol-A type epoxy resin; dispersion; electrical applications; electrical property; epoxy matrix; epoxy resin; epoxy-based nanocomposites; filler material; high voltage applications; insulation; mechanical property; neat epoxy samples; particle size; size 22 nm to 100 nm; surface functionalized microscale filler; thermal conductivity; thermal property; transmission electron microscopy; Conducting materials; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Electrons; Epoxy resins; Mechanical factors; Nanocomposites; Thermal conductivity; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on

Conference_Location

Virginia Beach, VA

ISSN

0084-9162

Print_ISBN

978-1-4244-4557-8

Electronic_ISBN

0084-9162

Type

conf

DOI

10.1109/CEIDP.2009.5377771

Filename

5377771