Title :
Tuning the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for MEMS Applications
Author :
Su, Wang Shen ; Huang, Hsin Yu ; Fang, Weileun
Author_Institution :
Nat. Nano Device Lab., Hsinchu
Abstract :
This study reports a novel method for tuning thin film mechanical properties by means of plasma surface modification. According to the experiment results, the formation of Si-N chemical bonds on the surface of SiO2 film will lead to an equivalent gradient residual stress; moreover, this gradient residual stress can be easily tuned by varying the conditions of NH3 plasma. These characteristics can be employed to tune the shape of micromachined beams for MEMS applications. In addition, the equivalent Young´s modulus of SiO2 films can be changed by plasma treatment; the resonant frequencies of the micromachined beams can also be tuned.
Keywords :
Young´s modulus; plasma materials processing; silicon compounds; surface treatment; thin films; SiO2; Young modulus; chemical bonds; equivalent gradient residual stress; micromachined beams; plasma surface modification; plasma treatment; Chemicals; Mechanical factors; Micromechanical devices; Plasma applications; Plasma chemistry; Plasma properties; Residual stresses; Resonant frequency; Shape; Transistors;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456322
