DocumentCode :
3051879
Title :
Measurement and estimation of temperature distribution inside core and cavity of the mold using virtual micro sensors
Author :
Luo, Ren C. ; Li, Zhi Wen ; Li, Ming Han
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
fYear :
2008
fDate :
20-22 Aug. 2008
Firstpage :
278
Lastpage :
283
Abstract :
The objective of this paper is to research to use a few MEMS (Micro Electron Mechanical System) temperature sensors for measurement and estimation of temperature distribution in the core and cavity of the mold during injection molding process. Decreasing the number of MEMS temperature sensors inside the core and cavity will reduce the cost for making product and still calibrate precisely. In this study, we describe the injection molding process equation with Hele-Shaw theory. And then we use simulation software to find the temperature values of the plastic flow in the mold wall. Using heat transfer and experimental error correction, we can deduce the actual temperature distribution inside core and cavity of the mold. Finally, account for comparing with deduction and experimental results from embedded micro temperature sensors, correct simulative data can verify our system as indicated above.
Keywords :
heat transfer; injection moulding; microsensors; plastic flow; production engineering computing; temperature distribution; temperature measurement; temperature sensors; Hele-Shaw theory; MEMS temperature sensors; experimental error correction; heat transfer; injection molding process; microelectron mechanical system; mold; plastic flow; simulation software; temperature distribution estimation; temperature distribution measurement; virtual microsensors; Costs; Electrons; Injection molding; Mechanical sensors; Mechanical systems; Mechanical variables measurement; Micromechanical devices; Temperature distribution; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multisensor Fusion and Integration for Intelligent Systems, 2008. MFI 2008. IEEE International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2143-5
Electronic_ISBN :
978-1-4244-2144-2
Type :
conf
DOI :
10.1109/MFI.2008.4648078
Filename :
4648078
Link To Document :
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