Title :
Trends in processor and system design and the interaction with advanced packaging
Author :
Hennessy, John L.
Author_Institution :
Stanford Univ., CA, USA
Abstract :
The author briefly looks at trends in microprocessor development and system architecture. A detailed discussion of the system designer´s challenges and of how an advanced packaging technology might help is presented. Trends in processor design, trends in system design, and opportunities and challenges for packaging technology are considered
Keywords :
computer architecture; hybrid integrated circuits; microprocessor chips; modules; packaging; technological forecasting; MCMs; advanced packaging; challenges; microprocessor development; opportunities; packaging technology; processor design; system architecture; system design; trends; CMOS technology; Clocks; Costs; Large-scale systems; Microprocessors; Multichip modules; Packaging machines; Process design; Random access memory; Time to market;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201431
