DocumentCode
3052300
Title
Silicon-on-silicon technology for CMOS-based computer systems
Author
Sudo, Toshio
fYear
1992
fDate
18-20 Mar 1992
Firstpage
8
Lastpage
11
Abstract
The main features of Si-on-Si technology are outlined. The electrical design of the wiring substrate is described, and chip connection and thermal design issues are addressed. Several options for mechanically supporting a large Si substrate are considered. A digital signal processing module developed using chip-on-wafer technology is discussed as an example. AlN ceramic was found to be an excellent packaging material to mechanically support a large Si substrate with high reliability
Keywords
Bonding; CMOS technology; Electronic packaging thermal management; Large scale integration; Multichip modules; Semiconductor thin films; Silicon; Substrates; Very large scale integration; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-2725-5
Type
conf
DOI
10.1109/MCMC.1992.201433
Filename
201433
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