Title :
Silicon-on-silicon technology for CMOS-based computer systems
Abstract :
The main features of Si-on-Si technology are outlined. The electrical design of the wiring substrate is described, and chip connection and thermal design issues are addressed. Several options for mechanically supporting a large Si substrate are considered. A digital signal processing module developed using chip-on-wafer technology is discussed as an example. AlN ceramic was found to be an excellent packaging material to mechanically support a large Si substrate with high reliability
Keywords :
Bonding; CMOS technology; Electronic packaging thermal management; Large scale integration; Multichip modules; Semiconductor thin films; Silicon; Substrates; Very large scale integration; Wiring;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201433
