Title :
Applications of multichip modules for high speed communications interfaces
Author_Institution :
Pacific Microelectron. Centre, Burnaby, BC, Canada
Abstract :
The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed
Keywords :
broadband networks; hybrid integrated circuits; modules; optical communication equipment; 622 Mbit/s; broadband communication; broadband crossconnect switching system; density requirements; fiber optic line interface; high speed communications interfaces; module solution; multichip modules; packaging technology; system design; system packaging; system performance; Asynchronous transfer mode; Backplanes; Bandwidth; Communication switching; Fiber optics; Multichip modules; Optical switches; Packaging machines; SONET; Switching systems;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201435
