Author :
Beiley, Mark ; Ichishita, Faith ; Nguyen, Cuong ; Wong, Simon
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
Abstract :
By utilizing conventional IC processing techniques, a membrane probe card has been fabricated on a silicon wafer and its functionality demonstrated. The probe card was able to provide a very large number of probe tips in an array form, permanently fixed in the X-Y plane via a transparent, flexible membrane. The use of an electrical current pulse, instead of a mechanical scrubbing motion, to break down the interfacial oxide has been demonstrated. The contact resistance was about 5×10-5 Ω-cm2. The new probe card offers smaller probe parasitics. The addition of the active test circuitry on the probe card would allow very high speed wafer level testing
Keywords :
VLSI; hybrid integrated circuits; integrated circuit testing; modules; production testing; active test circuitry; array probe card; contact resistance; electrical current pulse; flexible membrane; functionality; high speed wafer level testing; interfacial oxide breakdown; large number of probe tips; membrane probe card; smaller probe parasitics; transparent membrane; Biomembranes; Circuit testing; Conductors; Impedance; Inductance; Packaging; Polyimides; Probes; Silicon; Sputter etching;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201439
