Title :
Comparison of single and double barrier pseudomorphic doped-channel GaInP/GaInAs/GaAs HFET´s: performance and isolation properties
Author :
McLaughlin, Sheldon ; Xu, Xiangang ; Watkins, S.P. ; Bolognesi, C.R.
Author_Institution :
Dept. of Phys., Simon Fraser Univ., Burnaby, BC, Canada
Abstract :
Doped-channel GaInP/GaInAs/GaAs pseudomorphic heterostructure field-effect transistors (HFETs) were fabricated both with and without a GaInP barrier layer under the GaInAs channel. Two sets of alloy compositions were investigated: Ga0.85In0.15As channels with Ga0.51In0.49P barriers, and Ga0.70In0.30As channels with Ga0.62In 0.38P barriers. For each composition, 1.1 μm gate length devices with single and double barrier structures showed similar maximum drain currents (Idmas), and peak transconductances (gm ), while the double barrier devices showed reduced output conductances (gds) compared to the single barrier devices, resulting in a 30-50% larger voltage gain. RF measurements showed a higher maximum frequency of oscillation (fmax) for the double barrier devices of both compositions. For mesa etch isolation of the double barrier devices, it was found to be necessary to remove the bottom GaInP barrier layer to achieve satisfactory device isolation. We speculate that a parasitic 2-dimensional electron gas may be formed at the interface between the bottom GaInP barrier and the GaAs buffer layer
Keywords :
III-V semiconductors; etching; gallium arsenide; gallium compounds; high electron mobility transistors; indium compounds; interface states; isolation technology; junction gate field effect transistors; semiconductor device measurement; two-dimensional electron gas; 1.1 mum; Ga0.51In0.49P; Ga0.51In0.49P barriers; Ga0.62In0.38P; Ga0.62In0.38P barriers; Ga0.70In0.30As; Ga0.70In0.30As channels; Ga0.85In0.15As; GaInP barrier layer; GaInP-GaInAs-GaAs; GaInP/GaInAs/GaAs pseudomorphic heterostructure field-effect transistors; RF measurements; double barrier pseudomorphic doped-channel GaInP/GaInAs/GaAs HFET; isolation properties; maximum drain currents; mesa etch isolation; parasitic 2-dimensional electron gas; peak transconductance; reduced output conductance; single barrier pseudomorphic doped-channel GaInP/GaInAs/GaAs HFET; voltage gain; Buffer layers; Electrons; Etching; Frequency measurement; Gallium alloys; Gallium arsenide; HEMTs; MODFETs; Radio frequency; Voltage;
Conference_Titel :
Semiconducting and Insulating Materials, 1998. (SIMC-X) Proceedings of the 10th Conference on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-4354-9
DOI :
10.1109/SIM.1998.785094