Thermal management for ceramic multichip modules: experimental program

Author

Kromann, Gary B.

Author_Institution

TME Engineering, Murrysville, PA, USA

fYear

1992

fDate

18-20 Mar 1992

Firstpage

75

Lastpage

78

Abstract

The author describes the thermal characterization of an alumina-tungsten multilayer multichip module (MCM). A five-chip cavity-down MCM was designed to represent a typical substrate product. Thermal test multichip modules were assembled and the thermal performance quantified for both the internal and the external thermal resistances. The die junction-to-ambient resistance was measured in forced-air convection for the range of 1 to 5 m/s, for: (1) two pin-fin heat sinks, (2) a thermoelectric cooler with a pin-fin heat sink, and (3) a heat pipe with an integral extended surface. In addition, the run-to-run and the part-to-part variations, are presented. A discussion on the thermal management concepts and the heat transfer applicable to the MCM technology is included

Keywords

cooling; heat pipes; heat sinks; hybrid integrated circuits; modules; thermal resistance; 1 to 5 m/s; Al₂O₃-W; MCM; MLC-MCM; ceramic multichip modules; die junction-to-ambient resistance; experimental program; forced-air convection; heat pipe; heat sinks; heat transfer; multilayer multichip module; part-to-part variations; thermal characterization; thermal management; thermal performance; thermal resistances; thermoelectric cooler; Assembly; Ceramics; Heat sinks; Multichip modules; Nonhomogeneous media; Resistance heating; Surface resistance; Testing; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-2725-5

Type

conf

DOI

10.1109/MCMC.1992.201451

Filename

201451