DocumentCode :
3052715
Title :
Delay macromodels for point-to-point MCM interconnections
Author :
Kayssi, Ayman I. ; Sakallah, Karem A.
Author_Institution :
Dept. of Electr. Eng. & Comput Sci., Michigan Univ., Ann Arbor, MI, USA
fYear :
1992
fDate :
18-20 Mar 1992
Firstpage :
79
Lastpage :
82
Abstract :
Dimensional analysis is used to develop a macromodel for point-to-point multichip module (MCM) interconnect delay, which applies to lossless and lossy lines. The equation for lossless lines is linear and very simple; the equation for lossy lines is quadratic. In terms of computational costs, the evaluation of delay involves 24 multiplications, and is several orders of magnitude faster than using circuit simulation or transmission line analysis programs to calculate delays. Using the macromodel, the authors derived the dependence of delay on several technology parameters, and calculated the sensitivity of delay to the circuit parameters
Keywords :
hybrid integrated circuits; metallisation; modules; transmission line theory; MCM; computational costs; dimensional analysis; interconnect delay; lossless lines; lossy lines; macromodel; multichip modules; point-to-point interconnections; Capacitance; Capacitors; Delay effects; Distributed parameter circuits; Driver circuits; Equations; Impedance; Inductance; Integrated circuit interconnections; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
Type :
conf
DOI :
10.1109/MCMC.1992.201452
Filename :
201452
Link To Document :
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