Title :
Full wave electrical modeling of MCM by robust design methodology
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
The author describes the modeling of a glass ceramic multichip module (MCM) by using statistical design techniques. The electrical design of the MCM was achieved by a robust design technique using a full-wave electromagnetic solver. The design point was determined by modeling a five-level fractional factorial matrix covering the full range of the process capabilities. The design point yielded a 50-Ω characteristic impedance and a near-end noise of <5% of the logic swing
Keywords :
hybrid integrated circuits; modules; 50 ohm; MCM; characteristic impedance; electrical design; five-level fractional factorial matrix; full wave electrical modeling; full-wave electromagnetic solver; glass-ceramic modules; multichip modules; near-end noise; robust design methodology; statistical design techniques; Circuit noise; Design methodology; Electromagnetic modeling; Electromagnetic propagation; Impedance; Packaging; Propagation delay; Robustness; Signal design; Switches;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201453