Optical interfaces for multichip modules

An approach to an interconnection scheme for multichip modules (MCMs) based on the use of single-mode optical fiber and long-wavelength (1.3 μm) semiconductor diode lasers is described. The author considers some of the requirements of a fiber-based interconnection scheme applicable to MCM technology. For MCM interconnection work, many mechanical alignments and materials interfaces can be eliminated by mounting components on a silicon substrate. The development of a silicon waferboard approach has concentrated initially on the development of passively aligned transmitter arrays as a critical test of this technology. The addition of waveguide technology to a silicon waferboard can expand considerably the functionality and flexibility of this technology. Transmitter array development is considered. A completed transmitter array with an array of four passively aligned lasers and fibers along with a GaAs laser driver array is shown