DocumentCode
3053090
Title
31st International Conference on Electronics Manufacturing and Technology
fYear
2007
fDate
8-10 Nov. 2007
Abstract
The following topics are dealt with: advanced packaging; flip chip device; thermal analysis; solder joint modeling; mechanical analysis; reliability and quality; mechanical modeling; underfill material; MEMS; wirebond study and characterization; device process; interconnect/material; device test; molding material and process characterization.
Keywords
electronics packaging; flip-chip devices; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; lead bonding; micromechanical devices; moulding; MEMS; advanced packaging; device interconnect/material; device process; device quality; device reliability; device test; flip chip device; mechanical analysis; mechanical modeling; molding material; process characterization; solder joint modeling; thermal analysis; underfill material; wirebond characterization; wirebond study;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location
Petaling Jaya
ISSN
1089-8190
Print_ISBN
978-1-4244-0730-9
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2006.4456417
Filename
4456417
Link To Document