Title :
Silicon-on-silicon MCMs with integrated passive components
Author :
Frye, Robert C. ; Tai, King L. ; Lau, Maureen Y. ; Lin, Albert W C
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
The authors evaluate a prototype silicon-on-silicon multichip module for potential use in cost-driven applications. The incorporation of integrated passive components, resistors and capacitors, in the module substrate is a significant advantage in many of these kinds of applications. A module has been built that incorporates both linear and bipolar and digital CMOS circuits. The unique features of the module are discussed, as well as the properties and performance limits of the resulting passive components
Keywords :
elemental semiconductors; hybrid integrated circuits; integrated circuit technology; modules; silicon; Si on Si MCM; capacitors; cost-driven applications; integrated passive components; module substrate; multichip module; resistors; Aluminum; CMOS digital integrated circuits; CMOS technology; Capacitors; Consumer products; Dielectrics; Electrodes; Prototypes; Resistors; Substrates;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201473
