DocumentCode
3053125
Title
Characteristics of thin-film devices for a stack-type MCM
Author
Takahashi, Shuji ; Hayashi, Yoshihiro ; Kunio, Takemitsu ; Endo, Nobuhiro
Author_Institution
NEC Corp., Kanagawa, Japan
fYear
1992
fDate
18-20 Mar 1992
Firstpage
159
Lastpage
162
Abstract
A stack-type multichip module (MCM) or CUBIC (cumulative bonded IC) is proposed. The CUBIC is composed of thin-film device layers that are only a few micrometers thick stacked vertically and connected electrically. It has short chip-to-chip interconnections and a small module size. The characteristics of the thin-film devices are reported as a function of polished silicon layer thickness
Keywords
hybrid integrated circuits; integrated circuit technology; modules; packaging; thin film circuits; CUBIC; MCM; cumulative bonded IC; multichip module; polished Si layer thickness; stack-type; thin-film devices; Electrodes; Integrated circuit interconnections; Integrated circuit noise; Isolation technology; Semiconductor thin films; Silicon; Stacking; Substrates; Thin film devices; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-2725-5
Type
conf
DOI
10.1109/MCMC.1992.201474
Filename
201474
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