Title :
Rapid prototyping of multi-chip modules
Author :
Miracky, R. ; Galanakis, C. ; Hashemi, H. ; Hirsch, T. ; Madere, S. ; Müller, H. ; Rudwick, T. ; Sommerfeldt, S.
Author_Institution :
Microelectronics & Computer Technol. Corp., Austin, TX, USA
Abstract :
The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology
Keywords :
hybrid integrated circuits; integrated circuit technology; integrated circuit testing; laser beam applications; modules; packaging; MCM; conductor cutting; conductor linking; design; laser processes; multi-chip modules; multichip modules; rapid prototyping methodology; test; Bonding; Conducting materials; Conductors; Laser beam cutting; Laser theory; Microelectronics; Optical design; Prototypes; Wire; Wiring;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201475
