Title :
Green VFBGA Package Development for PoP Technology Study
Author :
Liu, J.M. ; Yuan, Yuan ; Gao, Wei ; Su, Y.Q. ; Han, Richard ; Han, M.C. ; Lu, Y.S.
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin
Abstract :
Market trends for PoP (package on package) developments and merits over SiP (system in package) are presented. A green VFBGA package used as bottom PoP package has been developed by applying advanced wafer thinning and dicing saw technology, low loop wire bonding technology and top gate thin molding technology. A preliminary MSL study showed good delamination performance.
Keywords :
ball grid arrays; system-in-package; wafer level packaging; green VFBGA package development; low loop wire bonding technology; package on package developments; system in package; top gate thin molding technology; wafer dicing saw technology; wafer thinning; Assembly; Electronics packaging; Integrated circuit packaging; Manufacturing; Packaging machines; Personal digital assistants; Semiconductor device packaging; Testing; Wafer bonding; Wire;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456423
