DocumentCode
3053206
Title
Green VFBGA Package Development for PoP Technology Study
Author
Liu, J.M. ; Yuan, Yuan ; Gao, Wei ; Su, Y.Q. ; Han, Richard ; Han, M.C. ; Lu, Y.S.
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin
fYear
2007
fDate
8-10 Nov. 2007
Firstpage
1
Lastpage
6
Abstract
Market trends for PoP (package on package) developments and merits over SiP (system in package) are presented. A green VFBGA package used as bottom PoP package has been developed by applying advanced wafer thinning and dicing saw technology, low loop wire bonding technology and top gate thin molding technology. A preliminary MSL study showed good delamination performance.
Keywords
ball grid arrays; system-in-package; wafer level packaging; green VFBGA package development; low loop wire bonding technology; package on package developments; system in package; top gate thin molding technology; wafer dicing saw technology; wafer thinning; Assembly; Electronics packaging; Integrated circuit packaging; Manufacturing; Packaging machines; Personal digital assistants; Semiconductor device packaging; Testing; Wafer bonding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location
Petaling Jaya
ISSN
1089-8190
Print_ISBN
978-1-4244-0730-9
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2006.4456423
Filename
4456423
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