DocumentCode
3053243
Title
Proceedings. 1992 IEEE Multi-Chip Module Conference MCMC-92 (Cat. No.92CH3124-5)
fYear
1992
fDate
18-20 March 1992
Abstract
The following topics are dealt with: multichip module (MCM) system implementations; known good die; module testing; interconnect simulation; assembly reliability and thermal management; interconnect modeling; substrate reliability; MCM system design; system partitioning and analysis; optoelectronics MCM; and exploratory and advanced MCM technologies. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords
hybrid integrated circuits; modules; MCM system design; MCM system implementations; advanced MCM technologies; assembly reliability; conference; interconnect modeling; interconnect simulation; known good die; module testing; multichip modules; optoelectronics MCM; partitioning; substrate reliability; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location
Santa Cruz, CA, USA
Print_ISBN
0-8186-2725-5
Type
conf
DOI
10.1109/MCMC.1992.201480
Filename
201480
Link To Document