Title :
Proceedings. 1992 IEEE Multi-Chip Module Conference MCMC-92 (Cat. No.92CH3124-5)
Abstract :
The following topics are dealt with: multichip module (MCM) system implementations; known good die; module testing; interconnect simulation; assembly reliability and thermal management; interconnect modeling; substrate reliability; MCM system design; system partitioning and analysis; optoelectronics MCM; and exploratory and advanced MCM technologies. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
hybrid integrated circuits; modules; MCM system design; MCM system implementations; advanced MCM technologies; assembly reliability; conference; interconnect modeling; interconnect simulation; known good die; module testing; multichip modules; optoelectronics MCM; partitioning; substrate reliability; thermal management;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA, USA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201480
