Title :
Overview and Emerging Challenges in Wafer Thinning Process for Handheld Applications
Author :
Ganesh, V.P. ; Lee, Charles
Author_Institution :
Infineon Technol. Asia Pacific Pte Ltd, Singapore
Abstract :
An overview and emerging challenges in wafer thinning process are discussed from view point of large Silicon (Si) wafer ultra thinning, bumped wafer thinning, chip strength enhancement and key enabling technology for advanced 3D packaging.
Keywords :
wafer level packaging; 3D packaging; bumped wafer thinning; chip strength enhancement; handheld applications; key enabling technology; large silicon wafer ultrathinning; wafer thinning process; Assembly; Chip scale packaging; Electronics packaging; Flip chip; Manufacturing processes; Marketing and sales; Mobile handsets; Semiconductor device packaging; Space technology; Wafer scale integration;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456426
