Title :
Practical Considerations in High Power LED Junction Temperature Measurements
Author_Institution :
Thermal Eng. Assoc. Inc., Mountain View
Abstract :
Power densities approaching 500 W/cm2 in the coming commercially available illumination LEDs has moved thermal management of power dissipation to the forefront in most package development efforts for this kind of product. These development efforts require a simple, accurate junction temperature measurement approach that can be implemented in the laboratory and on the production line. This presentation will describe the alternative junction temperature measurement approaches, then focuses on the most practical one with some discussion of measurement issues often encountered.
Keywords :
light emitting diodes; semiconductor device measurement; semiconductor device packaging; temperature measurement; thermal management (packaging); high power LED; junction temperature measurement; package development; power dissipation; thermal management; Electronic packaging thermal management; Frequency; Light emitting diodes; Manufacturing; Optical sensors; Power measurement; Pulse measurements; Steady-state; Temperature measurement; Thermal management;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456433