Title :
Thermal Analysis of Micro-Pipe Laden Substrate in Thermoelectric Micro-coolers
Author :
Abidi, Faisal Abbas ; Masood, S.H.
Author_Institution :
Jamia Millia Univ., New Delhi
Abstract :
With the increase in the chip packaging density the amount of heat generated from them has also increased considerably. Conventional cooling techniques are not well suited to solve the thermal problems that are arising as a result of this miniaturization of power microelectronic devices. We have developed a novel assembly of micro-pipe laden heat conducting substrate and thick film thermoelectric micro-cooler to deal with this issue. This paper presents the description of the novel micro-cooler fabrication technique and the results of the thermal analysis done on the micro-pipe laden substrate using the Pro/Mechanica thermal simulation package for varying performance factors.
Keywords :
assembling; chip scale packaging; cooling; integrated circuits; thermal analysis; thermoelectric devices; Pro/Mechanica thermal simulation package; chip packaging; heat generation; microcooler fabrication technique; micropipe laden heat conducting substrate assembling; power microelectronic devices; thermal analysis; thick film thermoelectric microcooler assembling; Assembly; Cooling; Fabrication; Microelectronics; Packaging; Performance analysis; Substrates; Thermal factors; Thermoelectricity; Thick films;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456434