Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison

Author

Ninomiya, Takanori ; Yoshimura, Kazushi ; Nomoto, Mineo ; Nakagawa, Yasuo

Author_Institution

Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan

fYear

1992

fDate

30 Aug-3 Sep 1992

Firstpage

53

Lastpage

56

Abstract

Describes a new automatic pattern inspection method which can reliably detect fatal circuit defects without giving false alarms due to circuit patterns with slightly jagged edges. Also described is a high-speed automatic inspection system for screen-printed circuit patterns of an unbaked ceramic layer, known as a green sheet. For fatal defect detection, the connectivity comparison method was adopted. In order to speed up this method and to further improve it, connectivity preserving image size reduction, a new concept, was developed

Keywords

automatic optical inspection; computer vision; hybrid integrated circuits; integrated circuit testing; thick film circuits; automatic optical inspection; automatic pattern inspection method; computer vision; connectivity comparison method; connectivity preserving image reduction; fatal circuit defects; fatal defect detection; green sheet; hybrid integrated circuits; integrated circuit testing; screen-printed circuit pattern; thick film circuits; unbaked ceramic layer; Ceramics; Data mining; Electronic circuits; Image edge detection; Inspection; Laboratories; Manufacturing industries; Printed circuits; Production engineering; Shape;

fLanguage

English

Publisher

ieee

Conference_Titel

Pattern Recognition, 1992. Vol.I. Conference A: Computer Vision and Applications, Proceedings., 11th IAPR International Conference on

Conference_Location

The Hague

Print_ISBN

0-8186-2910-X

Type

conf

DOI

10.1109/ICPR.1992.201506

Filename

201506