Towards Higher Reliability Challenge of Au-Al intermetalic system

The breakthrough of semiconductor technology advances at a very fast pace and it challenge to unlimited border. This has resulted in the transition of packaging to be smaller, thinner as well as higher density in circuitry components on single chip as well to much more complicated packaging such SIP, PIP which has more dies or more package stack on each other. This breakthrough is a combination from the creativity of designers/engineers (human), machine, process (method) and materials advancement. This paper will focus on advance materials of Au bonding wire interaction with Al bond pad metalization which have direct impact on packages´ performance and reliability.