Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation

In this paper, four modeling approaches such as InsCTE, MeanCTE, EqvCTE and CureCTE + MeanCTE, were employed to predict the substrate warpage. Both laminate and leadless leadframe substrates were evaluated. The effect of mold compound chemical cure shrinkage on the substrate warpage was also investigated. A laser profilometer was used to measure the warpage of the laminate and leadless leadframe substrates. Our findings show that CureCTE + MeanCTE modeling approach correlates well with the warpage measurement. Therefore, the effect of mold compound chemical cure shrinkage is important and has to be implemented appropriately in the model for accurate warpage predictions. It can also be used in package designs and material selections to eliminate the coplanarity issue and achieve an improved assembly process yield in future developments.