Title :
Discussions on the Failure Mode and Criterion of Passivation Cracks
Author_Institution :
STMicroelectron., Toa Payoh
Abstract :
Passivation cracks are studied with experimental observation and finite element simulation. Corner cracks are first initiated, and then edge cracks are subsequently initiated along the edge from the corner to the center. The cracks show a good symmetric pattern over both symmetric axes. Simulation results show that the maximum Von Mises stress is located at die corner, which correlates to the first crack initiation from experimental observation, and the direction of first principal stress matches exactly with the cracking direction (principal stress direction is vertical to the crack surface). Failure criterion for the passivation crack is then discussed.
Keywords :
cracks; finite element analysis; integrated circuit packaging; Von Mises stress; corner cracks; cracking direction; die corner; edge cracks; failure criterion; failure mode; finite element simulation; passivation cracks; symmetric axes; symmetric pattern; Electronic packaging thermal management; Electronics packaging; Finite element methods; Integrated circuit packaging; Passivation; Plastics; Stress; Surface cracks; Temperature; Virtual manufacturing;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456461