DocumentCode :
3053946
Title :
Discussions on the Failure Mode and Criterion of Passivation Cracks
Author :
Zhang, Xueren
Author_Institution :
STMicroelectron., Toa Payoh
fYear :
2007
fDate :
8-10 Nov. 2007
Firstpage :
248
Lastpage :
252
Abstract :
Passivation cracks are studied with experimental observation and finite element simulation. Corner cracks are first initiated, and then edge cracks are subsequently initiated along the edge from the corner to the center. The cracks show a good symmetric pattern over both symmetric axes. Simulation results show that the maximum Von Mises stress is located at die corner, which correlates to the first crack initiation from experimental observation, and the direction of first principal stress matches exactly with the cracking direction (principal stress direction is vertical to the crack surface). Failure criterion for the passivation crack is then discussed.
Keywords :
cracks; finite element analysis; integrated circuit packaging; Von Mises stress; corner cracks; cracking direction; die corner; edge cracks; failure criterion; failure mode; finite element simulation; passivation cracks; symmetric axes; symmetric pattern; Electronic packaging thermal management; Electronics packaging; Finite element methods; Integrated circuit packaging; Passivation; Plastics; Stress; Surface cracks; Temperature; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
ISSN :
1089-8190
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
Type :
conf
DOI :
10.1109/IEMT.2006.4456461
Filename :
4456461
Link To Document :
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